Metal plated aromatic polyimide film
AssigneeUbe Industries, Ltd.
InventorsTomohiko Yamamoto, Jun Takagi, Hiroto Shimokawa
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Abstract
A metal-plated aromatic polyimide film composed of an aromatic polyimide resin film, a surface layer of which contains a dispersed palladium metal or a palladium compound, and a metal layer which is chemically plated on the surface layer of the polyimide resin film. The surface layer is preferably formed by placing a palladium compound on a self-supporting aromatic polyimide precursor film and heating the self-supporting film having the palladium compound on its surface layer to a temperature at which the polyimide precursor is converted into its corresponding aromatic polyimide.
Claims14
A metal-plated aromatic polyimide film comprising an aromatic polyimide resin film, a surface layer of which contains a palladium metal or a palladium compound dispersed therein, and a metal layer which is chemically plated on the surface layer of the polyimide resin film.
Dependencies are inferred from the claim text.