Method of molding or curing a resin material at high temperatures using a multilayer release film

A method for molding or curing a resin material using a multilayer release film as a barrier at the surface of the resin material, the method comprising the surface of the resin material being in contact with the release film at a temperature of at least about 350° F. (about 180° C.), wherein the release film is non-oriented and comprises:

• a release layer which comprises polymethylpentene;
• an enhancement layer which comprises polyamide;
• and
• a tie layer which is sandwiched between the release layer and enhancement layer and comprises (i) polyethylene or modified polyethylene, and (ii) polypropylene or modified polypropylene.

A method for molding or curing a resin material using a multilayer release film as a barrier at the surface of the resin material, the method comprising contacting the resin material with the release film, wherein the release film is non-oriented and comprises 5 layers in the following order:

• a first release layer which comprises polymethylpentene;
• a first tie layer which comprises (i) polyethylene or modified polyethylene, and (ii) polypropylene or modified polypropylene;
• an enhancement layer which comprises polyamide;
• a second tie layer which comprises (i) polyethylene or modified polyethylene, and (ii) polypropylene or modified polypropylene;
• and
• a second release layer which comprises polymethylpentene.

A method for molding or curing a resin material using a multilayer release film as a barrier at the surface of the resin material, the method comprising contacting the resin material with the release film, wherein the release film is non-oriented and comprises:

• a release layer which comprises polymethylpentene;
• an enhancement layer which comprises polyamide;
• and
• a tie layer which is sandwiched between the release layer and enhancement layer and comprises an anhydride modified linear low density polyethylene and an anhydride modified polypropylene.

A non-oriented release film comprising 5 layers in the following order:

• a first release layer which comprises polymethylpentene;
• a first tie layer which comprises (i) polyethylene or modified polyethylene, and (ii) polypropylene or modified polypropylene;
• an enhancement layer which comprises polyamide;
• a second tie layer which comprises (i) polyethylene or modified polyethylene, and (ii) polypropylene or modified polypropylene;
• and
• a second release layer which comprises polymethylpentene.

A non-oriented release film comprising:

• a release layer which comprises polymethylpentene;
• an enhancement layer which comprises polyamide;
• and
• a tie layer which is sandwiched between the release layer and enhancement layer and comprises anhydride modified linear low density polyethylene and anhydride modified polypropylene.