Process for producing fast curing molding compounds bonded with phenolic resin

Abstract

A process is provided for producing fast curing bonded with phenolic resin, which comprises pulverulent phenolic resins mixed with or applied to the substrate to be adhered together with pulverulent addition polymers selected from the group consisting of polyvinyl alcohols and addition polymers, stabilized by hydroxyl-containing protective colloids of at least one monomer selected from the group consisting of the vinyl esters of branched or unbranched carboxylic acids of 1 to 12 carbon atoms, the esters of acrylic acid and methacrylic acid with branched or unbranched alcohols of 1 to 12 carbon atoms, vinylaromatics, vinyl halides, olefins and dienes, and subsequently, by the employment of elevated temperature and optionally elevated pressure, cured and processed into a shaped article.

Dependencies are inferred from the claim text.