Lead-free zinc-containing solder paste
AssigneesSenju Metal Industry Co., Ltd., Matsushita Electric Industrial Co., Ltd.
InventorsToshihiko Taguchi, Kunihito Takaura, Masahiko Hirata, Hisahiko Yoshida, Takashi Nagashima
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Abstract
A solder paste having a powder of a Zn-containing solder alloy such as an Sn—Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.
Claims7
A lead-free solder paste comprising a powder of a zinc-containing, lead-free solder alloy in admixture with a soldering flux with a glycidyl ether compound being added to the soldering flux in an amount of from 0.1% to 5.0% by weight based on the flux.
Dependencies are inferred from the claim text.