Back to results
US 6,440,186 B1Granted
Polishing composition and polishing method employing it
AssigneeFujimi Incorporated
InventorsKenji Sakai, Hiroshi Asano, Tadahiro Kitamura, Katsuyoshi Ina
Life of this patent
Estimating the term…
Abstract
A polishing composition comprising: (a) an abrasives (b) a compound to form a chelate with copper ions (c) a compound to provide a protective layer-forming function to a copper layer, (d) hydrogen peroxide, and (e) water, wherein the abrasive of component (a) has a primary particle size within a range of from 50 to 120 nm.
Claims9
A polishing composition comprising:
- (a) an abrasive in an amount range of 5 to 50 g/l based on the composition,
- (b) a compound to form a chelate with copper ions in an amount range of from 0.04 to 0.2 mol/l based on the composition,
- (c) a compound to provide a protective layer-forming function to a copper layer which is at least one compound selected from the group consisting of benzotriazole and derivatives thereof, and its content is in an amount range of 0.0002 to 0.002 mol/l based on the composition,
- (d) hydrogen peroxide in an amount range of from 0.03 to 1 mol/l based on the composition, and
- (e) water, wherein said abrasive has a primary particle size within a range of from 50 to 120 mn.
2 more elements
Dependencies are inferred from the claim text.