Resinoid grinding wheel
AssigneeNoritake Co., Limited
InventorsAkira Nagata, Shigeki Nakane
Life of this patent
Estimating the term…
Abstract
A resinoid grinding wheel of the present invention has low grinding resistance and is capable of providing a ground workpiece excellent in ground surface quality without burn mark while maintaining essential properties of the resinoid grinding wheel such as low elastic modulus and strong force for holding abrasive grains. A typical resinoid grinding wheel of the present invention includes 25 parts by volume of Al2O3 abrasive grains with grain size of #150, 20 parts by volume of organic hollow material with average particle diameter of 80 μm, and 10 parts by volume of pores having 1 mm in size. They are all dispersed in 40 parts by weight of a bond made of cured epoxy resin.
Claims17
A resinoid grinding wheel comprising abrasive grains, particles of an organic hollow material and a pore-forming agent dispersed in a resinoid bond, the organic hollow material particles having an average diameter in a range of not less than 10 μm and not more than 300 μm, said resinoid bond being made of a cured resin which is produced by curing at least one liquid resin selected from the group consisting of epoxy resin, acrylic resin and urethane resin,
- wherein a ratio U/B by volume of the organic hollow particles U to the resinoid bond B is not less than 5/100 and not more than 80,100,
- wherein particles of said organic hollow material particles are discretely dispersed in and fully surrounds by the resinoid bond and
- wherein the abrasive grains, except for those dispersed on a surface of the grinding wheel, are fully surrounded by the resinoid bond.
A resinoid grinding wheel comprising abrasive grains and filler dispersed in a resinoid bond, the filler comprising an amount of organic hollow material having an average diameter in a range of not less than 10 μm and not more than 300 μm, said bond being made of a cured resin which is produced by curing at least one liquid resin selected from the group consisting of epoxy resin, acrylic resin and cured urethane resin,
- wherein the ratio U/B by volume of the organic hollow material U to the bond B is not less than 5/100 and not more than 80/100,
- wherein said abrasive grains, except for those dispersed on a surface of the grinding wheel, are fully surrounded by the resinoid bond having therein said organic hollow material in the form of dispersed discrete bubbles,
- said organic hollow material providing a receding property to the bond on a grinding surface of the grinding wheel,
- wherein said organic hollow material is made of a substance selected from the group consisting of an acrylic resin and a polyvinylidene chloride-based resin.
A method for manufacturing a resinoid grinding wheel, comprising:
- mixing liquid resin with particles of an organic hollow material to form a first mixture to discretely disperse the organic hollow material particles in the liquid resin,
- adding a curing agent to the first mixture to form a second mixture,
- adding a pore-forming agent to the second mixture, and
- adding abrasive grains to the second mixture,
- wherein the resinoid grinding wheel comprising the abrasive grains, the organic hollow material particles and the pore-forming agent dispersed in a resinoid bond, the organic hollow material having an average diameter in a range of not less than 10 μm and not more than 300 μm, said resinoid bond being made of a cured resin which is produced by curing at least one liquid resin selected from the group consisting of epoxy resin, acrylic resin and urethane resin,
- wherein particles of said organic hollow particles are discretely in and fully surrounded by the resinoid bond and
- wherein the abrasive grains, except for those dispersed on a surface of the grinding wheel, are fully surrounded by the resinoid bond.
Dependencies are inferred from the claim text.