Method for bonding collector plates to end faces of electrode plates
AssigneesMatsushita Electric Industrial Co., Ltd., Toyota Jidosha Kabushiki Kaisha, Mitsubishi Denki Kabushiki Kaisha
InventorsShoji Karasawa, Hiromi Kajiya, Yoshihiro Tokutome, Masaru Masaki, Shinichi Hibino, You Noguchi
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Abstract
Positive electrode plates and negative electrode plates are arranged alternately with intervening separators, and their end faces are respectively butted on collector plates. A solder material made from nickel alloy is disposed on the surfaces of the collector plates, which are made from nickel. An electron beam is irradiated onto the collector plates for causing the solder material to melt, thereby bonding the end faces of the positive and negative electrode plates with the collector plates.
Claims9
A method for manufacturing a battery comprising the steps of:
- providing a solder material made from nickel alloy on a surface of a collector plate;
- arranging a plurality of electrode plates perpendicular to the collector plate so that end faces of the electrode plates abut with the solder material on the collector plate;
- and
- irradiating an electron beam onto the collector plate from a direction opposite from the electrode plates for causing the solder material to melt, thereby bonding the end faces of the electrode plates with the collector plate.
Dependencies are inferred from the claim text.