Modular semiconductor workpiece processing tool

A workpiece processing apparatus, comprising:

• a workpiece conveyor system including
• a central support extending along a linear transfer path,
• a first workpiece transport unit mounted to a first side of the central support for translational movement along the linear transfer path at a first horizontal side of the central support, the first workpiece transport unit including a tram mounted for linear movement along the central support and an arm assembly connected to the tram that terminates at an end effector that is adapted to support a workpiece;
• a second workpiece transport unit mounted to a second side of the central support for translational movement along the linear transfer path and in parallel with the movement of the first workpiece transport, the second workpiece transport unit including a tram mounted for linear movement along the central support and an arm assembly connected to the tram that terminates at an end effector that is adapted to support a workpiece;
• a linear drive system connected to drive the first and second workpiece transport units independently along the linear transfer path;
• a plurality of workpiece processing modules disposed on opposite sides of the central support and along the linear transfer path, the arm assembly of each of said first and second workpiece transport units being adapted to place said workpieces in one or more of said workpiece processing modules or remove said workpieces from one or more of said workpiece processing modules.

A transport system for manipulating a wafer within a processing section of a processing apparatus used in microelectronic fabrication, the transport system comprising:

• first and second wafer transfer units;
• a transport unit guide for supporting the first and second wafer transfer units as each unit moves independently between a respective first position and a respective second positive, the transport unit guide comprising
• a frame,
• first and second lateral guide rails spaced apart horizontally and mounted on opposite sides of the frame, and
• a series of magnetic segments arranged upon the transport unit guide proximate the first and second lateral guides rails;
• each of the first and second wafer transfer units comprising
• a tram attached to the respective lateral guide rail for linear movement therealong,
• a wafer transfer arm assembly attached to the respective tram for manipulating the wafer,
• an electromagnet mounted on the tram in cooperative relation with a respective set of the magnetic segments for moving the wafer transfer unit along the respective guide rail in response to control signals,
• actuators responsive to control signals for controlling the movement of the transfer arm assembly,
• sensors for monitoring the position of the transfer unit along the respective guide rail and the positional state of the transfer arm assembly;
• a controller disposed remote of the first and second transfer unit, the controller being responsive to signals received from the sensors and providing the control signals for directing the movement of the first and second transfer units and the respective transfer arm assemblies;
• and
• a communication link between the first and second wafer transfer units and the controller for facilitating control of the operation of the wafer transfer units.

A wafer processing apparatus for use in microelectronic fabrication, the wafer processing apparatus comprising:

• a wafer conveyor system including
• a central support extending along a linear transfer path,
• a first wafer transport unit disposed on a first side of the central support and mounted thereto for translational movement along the linear transfer path,
• a second wafer transport unit disposed on a second side of the central support, on the opposite side from the first side and spaced horizontally apart, and mounted thereto for translational movement parallel to the first transport unit along the linear transfer path, the second wafer transport unit being movable independent of the first wafer transport unit;
• a plurality of wafer processing stations adjacent opposite sides of said linear transfer path;
• and
• said first and second wafer transport units each including a wafer transfer assembly for respectively supporting an individual wafer and for accessing at least one of said wafer processing stations for transferring a wafer to the at least one of said wafer processing stations or from the at least one of said wafer processing stations.