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US 6,439,987 B1Granted
Tool and method for the abrasive machining of a substantially planar surface
AssigneeWacker Siltronic Gesellschaft fur Halbleitermaterialien AG
InventorsBert Ripper, Hubert Grubmüller
Life of this patent
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Abstract
A tool and method are provided for the abrasive machining of a substantially planar surface. The tool has a base body and a plurality of elements which are mounted on the base body and form a planar coating which is used as a working coating during machining of the surface.
Claims7
A tool for the abrasive machining of a substantially planar surface, which is used during semiconductor material production, comprising
- a base body;
- and
- a plurality of elements which are mounted on the base body and said elements form a planar coating on the base body;
- and
- said planar coating is used as a working coating during machining of the surface;
- and
- wherein the elements are produced by casting metal and only those elements which have a substantially uniform microstructure and hardness are mounted on the base body.
4 more elements
A tool for the abrasive machining of a substantially planar surface comprising
- a base body;
- and wherein the base body is a circular ring and has an annular hole;
- and
- a plastic disk located in said annular hole to close said annular hole;
- a plurality of elements which are mounted on the base body and said elements form a planar coating on the base body;
- and
- said planar coating is used as a working coating during machining of the surface.
4 more elements
Dependencies are inferred from the claim text.