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US 6,439,977 B1Granted
Rotational slurry distribution system for rotary CMP system
AssigneeChartered Semiconductor Manufacturing Ltd.
Inventor(Sebastian) Ser Wee Quek
Life of this patent
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Abstract
An apparatus for slurry distribution during semiconductor wafer polishing operations. The slurry is gravity fed or fed under pressure and broadcast under an angle across the entire face of the polishing pad by either a rotating slurry nozzle arrangement or by a rotating slurry shaft arrangement. This as opposed to the conventional slurry supply lines, which are stationary in design.
Claims4
A method for chemical mechanical planarization of a semiconductor wafer, comprising:
- providing a rotating platform for mounting semiconductor wafers;
- providing a rotating platform for mounting semiconductor polishing pads;
- providing a means for evenly distributing slurry across a polishing pad comprising a slurry supply shaft which is mounted within a slurry supply reservoir and wherein a lower extremity of a rotating slurry supply shaft has a means for distributing said slurry, said means for distributing said slurry comprising at least one opening in a lower extremity of said rotating slurry supply shaft whereby downward motion of said slurry is transformed into a rotating motion of said rotating slurry supply shaft;
- and
- providing a means for controlling rate of slurry flow.
2 more elements
Dependencies are inferred from the claim text.