Polishing pad having a water-repellant film theron and a method of manufacture therefor
AssigneeAgere Systems Guardian Corp.
InventorYaw S. Obeng
Life of this patent
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Abstract
The present invention provides a polishing pad. The polishing pad includes a base pad, such as a felt pad, having an outer surface, and a water-repellant film located on the outer surface. The water-repellant film typically provides the base pad with a water absorbency factor of less than about five percent. In another embodiment, the polishing pad has an outer surface having an outer edge and first and second opposing surfaces joined by the outer edge. The polishing pad, in a preferred embodiment, has the water-repellant film located on the outer edge and one of the first and second opposing surfaces. Located on the water-repellant film on one of the first and second opposing surfaces, in another embodiment, is a pressure sensitive adhesive.
Claims13
A method of manufacturing a semiconductor device, comprising:
- forming transistors on a semiconductor wafer;
- forming a substrate over said transistors;
- positioning said semiconductor wafer on a polishing pad, said polishing pad including:
- a base pad having a first platen surface and a second opposing surface, wherein said first platen surface and said second opposing surface are joined by an outer edge;
- and
- a continuous water-repellant film layer located on said first platen surface and said outer edge;
- polishing said substrate of said semiconductor wafer with said pad;
- and
- interconnecting said transistors to form an integrated circuit.
Dependencies are inferred from the claim text.