Cleaning apparatus
AssigneeEbara Corporation
InventorKoji Ato
Life of this patent
Estimating the term…
Abstract
An apparatus performs at least one of cleaning and drying a semiconductor wafer while rotating the semiconductor wafer. The apparatus has a rotating mechanism for rotating the semiconductor wafer, and a sensor for detecting a reference position such as a notch or an orientation flat of the semiconductor wafer. The semiconductor wafer may be stopped from rotating to align the reference position with a predetermined position based on an output signal from the sensor.
Claims36
A polishing apparatus for polishing a workpiece, said apparatus comprising a polishing section for a surface of the workpiece, and a cleaning apparatus for cleaning the thus polished surface of the workpiece, said cleaning apparatus comprising:
- a rotating mechanism for rotating the workpiece;
- a sensor for detecting a reference position of the workpiece;
- and
- a controller for determining a rotational speed of the workpiece as a function of an output signal from said sensor.
An apparatus for processing a workpiece, comprising:
- a rotating mechanism of a cleaning operation or drying operation for rotating the workpiece such that one of the cleaning operation and the drying operation is performed on the workpiece while the workpiece is being rotated by said rotating mechanism;
- a sensor for detecting a reference position of the workpiece being rotated by said rotating mechanism and providing an Output signal;
- and
- a controller communicating with said sensor, said controller being operable to determine a rotational speed of the workpiece as a function of the output signal from said sensor.
An apparatus for rotating a workpiece having in an outer circumferential edge thereof an orientation flat or a notch, during which rotation the workpiece may be subjected to at least one of a cleaning operation, including supplying a cleaning liquid to the workpiece during rotation thereof, and a drying operation, including rotating the workpiece at a high speed, said apparatus comprising:
- a rotating mechanism for rotating the workpiece;
- a sensor for detecting a reference position of the workpiece represented by the orientation flat or a notch therein;
- and
- a controller operatively connected to said rotating mechanism for controlling operation thereof as a function of an output signal from said sensor to:
- rotate said rotating mechanism and thereby the workpiece during an operation of cleaning the workpiece;
- rotate said rotating mechanism and thereby the workpiece at a high speed during an operation of drying the workpiece;
- and
- stop rotation of said rotating mechanism to align the reference position of the workpiece at a predetermined position relative to a rotation axis of said rotating mechanism at the completion of at least one of the cleaning operation and the drying operation.
A polishing apparatus for polishing a workpiece having in an outer circumferential edge thereof an orientation flat or a notch, said apparatus comprising a polishing section for polishing a surface of the workpiece, and a cleaning apparatus for performing at least one of an operation of cleaning the thus polished surface of the workpiece and an operation of drying the thus clean polished workpiece, said cleaning apparatus comprising:
- a rotating mechanism for rotating the workpiece;
- a sensor for detecting a reference position of the workpiece represented by the orientation flat or a notch therein;
- and
- a controller operatively connected to said rotating mechanism for controlling operation thereof as a function of an output signal from said sensor to:
- rotate said rotating mechanism and thereby the workpiece during an operation of cleaning the workpiece;
- rotate said rotating mechanism and thereby the workpiece at a high speed during an operation of drying the workpiece;
- and
- stop rotation of said rotating mechanism to align the reference position of the workpiece at a predetermined position relative to a rotation axis of said rotating mechanism at the completion of at least one of the cleaning operation and the drying operation.
Dependencies are inferred from the claim text.