Electrical connector configured by wafers including moveable contacts

An electrical system, comprising:

• a first substrate having a first conductive pad thereon;
• a second substrate having a second conductive pad thereon, said second substrate being arranged orthogonal with respect to said first substrate;
• and
• an electrical connector arranged between the first and second substrates for establishing electrical connections therebetween and defining first and second surfaces with said second surface facing said first substrate, the electrical connector including a plurality of wafer stacked together, each wafer including a card receiving passageway for receiving said second substrate therein and a plurality of passageways symmetrically arranged with respect to said card receiving passageway and extending from inner walls of said card receiving passageway to said second surface of said connector;
• and
• a plurality of terminals each moveably received in corresponding said passageways and having first and second contact portions;
• wherein before said second substrate is inserted into said card receiving passageway, said first contact portion rests on first conductive pad of said first substrate, while said second contact portion extends into said card receiving passageway;
• wherein when said second substrate is inserted into said card receiving passageway and in contact with said second contact portion of said terminal, said terminal is driven to move along said passageway such that both said first and second contact portions wipes, respectively, over first and second conductive pads of said first and second substrates thereby providing effective and reliable electrical connections therebetween.

An electrical system, comprising:

• a first substrate having a first conductive pad thereon;
• a second substrate having a second conductive pad thereon, said second substrate being arranged orthogonal with respect to said first substrate;
• and
• an electrical connector arranged between the first and second substrates for establishing electrical connections therebetween and defining first and second surfaces with said second surface facing said first substrate, the electrical connector including a plurality of wafer stacked together, each wafer including a card receiving passageway for receiving said second substrate therein and a plurality of passageways symmetrically arranged with respect to said card receiving passageway and extending from inner walls of said card receiving passageway to said second surface of said connector;
• and
• a plurality of terminals each moveably received in corresponding said passageways and having first and second contact portions;
• wherein before said second substrate is inserted into said card receiving passageway, said first contact portion rests on first conductive pad of said first substrate, while said second contact portion extends into said card receiving passageway;
• wherein when said second substrate is inserted into said card receiving passageway and in contact with said second contact portion of said terminal, said second contact portion is driven into said passageway, while the first contact portion extends outward from said passageway.