Method and apparatus for lifting an integrated circuit from a socket
AssigneeAdvanced Micro Devices, Inc.
InventorsAnthony Andric, Ruel Hill, Doug Markwardt
Life of this patent
Estimating the term…
Abstract
A lift mechanism is provided that facilitates removal of an integrated circuit from a socket. Such a socket includes a base portion and a cover that slidably engages with the base portion. An actuation device moves the cover laterally with respect to the base. A lift mechanism responds to the cover moving in a first lateral direction into an open position in which the integrated circuit can be removed from the socket, by moving at least partially in an upward direction sufficiently to displace the integrated circuit away from the socket, thereby more easily allowing the integrated circuit to be grasped and removed from the socket.
Claims14
An electrical socket for use with a packaged integrated circuit, comprising:
- a base portion having a ramp portion disposed on its top surface;
- a cover slidably engaged with the base portion;
- an actuation device coupled to move the cover laterally with respect to the base;
- and
- at least one flexible lift mechanism integral with the cover and responsive to the cover moving in a first lateral direction, to bend at least partially in an upward direction sufficiently to engage and displace the packaged integrated circuit away from the socket, the first lateral direction being into an open position.
An electrical socket for receiving an integrated circuit, comprising:
- a base portion;
- a cover slidably engaged with the base portion;
- an actuation device coupled to move the cover laterally with respect to the base;
- at least one spring extending from the base portion;
- at least one projecting member responsive to the cover being moved laterally into a closed position to engage the spring to thereby prevent the spring from exerting a force on an integrated circuit inserted in the socket;
- and wherein
- the projecting member is responsive to the cover being moved laterally into an open position to disengage from the spring so the spring exerts an upward force on an integrated circuit inserted in the socket, thereby allowing a user to grasp the integrated circuit for removal.
A method for utilizing a socket that includes a base portion, and a cover slidably engaged with the base portion that moves laterally with respect to the base portion into an open and closed position, the method comprising:
- moving the cover from a closed to an open position with an actuation mechanism to allow an inserted integrated circuit to be removed from the socket;
- and
- forcing a flexible lift mechanism to bend upward as the lift mechanism engages a ramp formed on the surface of the base portion as the cover moves from the closed to the open position, thereby displacing the integrated circuit in an upwardly vertical direction in response to the cover moving towards the open position.
A method for utilizing a socket that includes a base portion, and a cover slidably engaged with the base portion that moves laterally with respect to the base portion into an open and closed position, the method comprising:
- moving the cover from a closed to an open position with an actuation mechanism to allow an inserted integrated circuit to be removed from the socket;
- displacing the integrated circuit in an upwardly vertical direction in response to the cover moving towards the open position and wherein the integrated circuit is displaced in an upwardly vertical direction by at least one spring coupled to the base, as the cover moves towards the open position.
A socket for receiving an integrated circuit comprising:
- a base portion;
- a cover slidably engaged with the base portion for movement in a first and second lateral direction;
- and
- means for displacing the integrated circuit received into the socket in an upward direction in response to the cover moving in a first lateral direction towards an open position, the open position allowing the integrated circuit to be removed from the socket, the means for displacing including a means formed integrally with the cover, for bending upward in response to the cover being moved in the first lateral direction, thereby displacing the integrated circuit.
Dependencies are inferred from the claim text.