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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsShozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa, Makoto Akita, Kenji Okamoto, Shinzo Eguchi, Yasuhiro Kametani
Estimating the term…
When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed. Thus generation of defective components is prevented and a yield can be improved.
A bump joining determination method for deciding whether bump joining is good or defective at a time when electrodes of an electronic component and electrode parts of a circuit board are joined via bumps with the electronic component and circuit board relatively vibrated, said method comprising:
A semiconductor component manufacture method for manufacturing a semiconductor component by joining electrodes of an electronic component and electrode parts of a circuit board via bumps with use of ultrasonic vibration, said method comprising:
A bump joining determination apparatus for deciding whether bump joining is good or defective at a time when electrodes of an electronic component and electrode parts of a circuit board are joined via bumps with the electronic component and the circuit board relatively vibrated so as to manufacture a semiconductor component, said apparatus comprising:
A semiconductor component manufacturing apparatus for joining electrodes of an electronic component and electrode parts of a circuit board via bumps with use of ultrasonic vibration so as to manufacture a semiconductor component, said apparatus comprising:
Dependencies are inferred from the claim text.