Electronic component, method of sealing electronic component with resin, and apparatus therefor

A method of introducing resin for a flip chip, said flip chip being formed of a semiconductor chip and a printed circuit board connected together via a bump, said flip chip being set in a resin molding die at a predetermined position, the resin being introduced into a gap provided between said semiconductor chip and said printed circuit board, comprising the steps of:

• with said printed circuit board and said semiconductor chip each having a surface covered with a mold release film, fitting said semiconductor chip into a cavity of said molding die to set said semiconductor chip therein;
• adjoining opposite parting surfaces of said molding die together to close said molding die;
• introducing fluid pressure into said cavity and exerting the fluid pressure via a mold release film onto at least a member attaching surface of said semiconductor chip in said cavity to press said mold release film into close contact with said member attaching surface;
• after said mold release film is pressed into close contact with said member attaching surface, pressurizing and thus introducing a molding source material of resin into said cavity to cover with said resin a surface of said semiconductor chip excluding at least said member attaching surface and fill with said resin a gap provided between said semiconductor chip and said printed circuit board.

An apparatus for sealing with resin a semiconductor chip mounted on a printed circuit board, to fabricate an electronic component, comprising:

• resin molding means including a first main die and another main die and an intermediate die that can be opened and closed, as desired, relative to said first main die in arrangement;
• setting means for setting in any of said first main die and said another main die at a predetermined position said printed circuit board with said semiconductor chip mounted thereon;
• closing and opening means for selectively closing and opening said first main die or said another main die with said semiconductor chip set therein and said intermediate die together, and also for adjoining together said intermediate die and a periphery of said printed circuit board in said first main die to clamp said resin molding means;
• stretching means for stretching a mold release film over a back surface of said semiconductor chip and a front surface of said intermediate die;
• pressing means for pressing said mold release film into close contact with the back surface of said semiconductor chip;
• resin introducing means for introducing melted resin into a cavity and curing the introduced resin therein to seal with the resin said semiconductor chip mounted on said printed circuit board, said cavity being defined by said printed circuit board, said intermediate die and said mold release film;
• and
• removing means for removing said mold release film stretched across the back surface of said semiconductor chip and the front surface of said intermediate die.