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US 6,437,679 B1Granted
Device for temperature determination and process for manufacturing such a device
AssigneeSiemens Aktiengesellschaft
InventorPatrick Roques
Life of this patent
Estimating the term…
Abstract
A temperature sensor, of the type including a body (2) holding flat pin connection terminals (3, 3′) connected to a sensitive element (4), which body is compound-filled in a cup (1), characterized in that the sensitive element is embedded in a thermal paste (5) that acts as a stop wall for the compound-filling material forming the body.
Claims3
In a temperature sensor of the type having a cup filled with a compound-filling material forming a body holding flat pin connection terminals connected to a sensitive element, the improvement which comprises:
- a thermal paste embedding said sensitive element adjacent said compound-filling material and forming a stop wall for said compound-filling material forming said body, said compound filling material being cooled from introduction against said stop wall in a molten state.
A method of producing a temperature sensor, comprising:
- providing a cup;
- placing a quantity of thermal paste in a bottom of the cup;
- forming a body holding flat pin connection terminals connected to a sensitive element by compound-filling the cup with a molten compound-filling material and thereby forming a stop wall against the compound-filling material with the thermal paste at the bottom of the cup, such that the thermal paste encases the sensitive element at the bottom of the cup when the body is formed.
Dependencies are inferred from the claim text.