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US 6,436,320 B1Granted
Method using manifold system having flow control
AssigneeSynventive Molding Solutions, Inc.
InventorsDavid Kazmer, Mark D. Moss
Life of this patent
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AssigneeSynventive Molding Solutions, Inc.
InventorsDavid Kazmer, Mark D. Moss
Estimating the term…
An injection molding apparatus is provided in which the rate of material flow during the injection cycle is controlled. According to one preferred embodiment, a method is provided for use in an injection molding apparatus including a hot runner assembly comprising a manifold and at least first and second injection nozzles, the hot runner assembly to direct material injected into said manifold through said at least first and second injection nozzles through a corresponding at least first and second gates to one or more mold cavities. The method includes the steps of injecting material into the manifold, controlling, in the hot runner away from the first gate, a first rate at which material is injected through the first gate, and controlling, in the hot runner away from the second gate, a second rate at which material is injected through the second gate, independently from the first rate.
In an injection molding apparatus including a manifold and at least first and second injection nozzles, the apparatus to direct material injected into said manifold through said at least first and second injection nozzles through a corresponding at least first and second gates to one or more mold cavities, a method comprising steps of:
In an injection molding apparatus including a manifold and at least first and second injection nozzles to direct material injected into the manifold and at least first and second injection nozzles and through at least first and second gates in communication therewith and into one or more mold cavities, a method comprising the steps of:
Dependencies are inferred from the claim text.