Perforating machining method with laser beam
AssigneeHonda Giken Kogyo Kabushiki Kaisha
InventorsTokuji Okumura, Kazushiro Wakabayashi, Kazuo Isogai, Hideshi Takekuma, Tsuneo Otake
Life of this patent
Estimating the term…
Abstract
Assuming that t1 represents a period of time until a detection signal is outputted after a sensor senses a laser beam passed through a through-hole of a workpiece, t2 represents a period of time until the detection signal derived from the sensor exceeds a preset threshold value, and t3 represents a period of time until radiation of the laser beam is actually stopped after the threshold value is exceeded, a total period of time (t1+t2+t3) of the periods of time t1 to t3 is set to be shorter than a time difference (T2−T3) between a pulse width (T3) and one cycle (T2) of a pulse signal for constructing a laser output command signal.
Claims7
A perforating machining method based on the use of a laser beam, comprising the steps of:
- forming a through-hole through a workpiece by radiating said laser beam toward said workpiece;
- and
- sensing said laser beam passed through said through-hole by means of a sensor to stop radiation of said laser beam on the basis of a detection signal derived from said sensor, wherein:
- a pulse signal for controlling said laser beam is set so that a period of time until said radiation of said laser beam is stopped after said laser beam passed through said through-hole is sensed by said sensor is shorter than a period of time until the next pulse signal to be continued is in an ON state.
A perforating machining method based on the use of a laser beam for forming a weak portion for an air bag by boring a plurality of minute through-holes through a cover installed to an opening for said air bag as an automobile part, said method comprising the steps of:
- applying through-hole machining to said cover by radiating said laser beam toward a back surface of said cover;
- sensing said laser beam passed through said through-hole of said cover by means of a sensor to stop radiation of said laser beam on the basis of a detection signal derived from said sensor;
- and
- relatively displacing a laser beam-oscillating unit and said cover by a predetermined pitch to form said weak portion including said plurality of through-holes in accordance with a predetermined machining pattern, wherein:
- a part of said weak portion, which is disposed on a side of said back surface of said cover, is formed as a substantially linear groove, while a part of said weak portion, which is disposed on a side of a front surface of said cover, is formed by said plurality of through-holes separated from each other by a predetermined pitch.
Dependencies are inferred from the claim text.