Process for formation of a coating on a substrate

A continuous process for coating a substrate, comprising:

• continuously moving the substrate according to one direction through at least one enclosure comprising a target having at least one surface layer, the at least one surface layer of the target comprising at least one element,
• maintaining the target at a negative potential in relation to the substrate and a plasma between the at least one surface layer and the substrate, and maintaining the target at a temperature sufficient to enable said at least one element to have a vapor tension in the enclosure giving rise to a transition to a vapor state,
• transiting to a vapor state a first portion of the at least one element of the at least one surface layer to form a vapor that receives the plasma, by controlling the target temperature, and condensing the vapor onto the substrate;
• simultaneously with said transiting to a vapor state and condensing, cathodic sputtering the at least one surface layer of the target to deposit a second portion of the at least one element onto the substrate, by dissipating power density at the target,
• locating a magnetic circuit beneath the target for producing a discharge therefrom having a direction parallel to said moving substrate, so as to maintain the plasma in proximity of said at least one surface layer,
• cooling the magnetic circuit;
• selecting a ratio of said first portion to said second portion of the at least one element within a range from 50/50 to 98/2, for obtaining an optimal adhesion of a coating of said at least one element to the substrate;
• and
• maintaining the selected ratio under variable conditions of said continuous process for coating said continuously moved substrate, by simultaneously and reciprocally regulating said target temperature and said dissipation of power density at the target.