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AssigneeFormFactor, Inc.
InventorsBenjamin N. Eldridge, Igor Y. Khandros, David V. Pedersen, Ralph G. Whitten
Estimating the term…
One embodiment of the present invention concerns a design methodology for generating a test die for a product die including the step of concurrently designing test circuitry and a product circuitry in a unified design. The test circuitry can be designed to provide a high degree of fault coverage for the corresponding product circuitry generally without regard to the amount of silicon area that will be required by the test circuitry. The design methodology then partitions the unified design into the test die and the product die. The test die includes the test circuitry and the product die includes the product circuitry. The product and test die may then be fabricated on separate semiconductor wafers. By partitioning the product circuitry and test circuitry into separate die, embedded test circuitry can be either eliminated or minimized on the product die. This will tend to decrease the size of the product die and decrease the cost of manufacturing the product die while maintaining a high degree of test coverage of the product circuits within the product die.
A method of designing a test die for a product die, comprising:
A method of designing a test die and a product die, comprising:
A method of producing a tester, comprising:
A test die for testing product circuitry of a separate product die, the test die comprising:
A medium readable by a computing device, the medium storing a sequence of instructions for generating a description of a test die and a description of a product die, wherein the instructions cause the computing device to:
A method of designing a product die for a test die, comprising:
Dependencies are inferred from the claim text.