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US 6,428,328 B2Granted
Method of making a connection to a microelectronic element
AssigneeTessera, Inc.
InventorsBelgacem Haba, Anthony B. Faraci
Life of this patent
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AssigneeTessera, Inc.
InventorsBelgacem Haba, Anthony B. Faraci
Estimating the term…
A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the through hole. Contact pads on the second major surface of the dielectric layer overlie the through holes to provide a blind end which is electrically connected to the other contact by means of a metal layer lining the through hole. The resulting connectors provide low or zero insertion force sockets for mounting microelectronic elements having bump leads thereto. The bump leads may be received within corresponding sockets without engagement with the contact or projection, and then, by movement in a lateral direction, engaging the contact or projection to provide electrical connection to the socket.
A connector for mounting a microelectronic element thereto, said connector comprising a sheetlike body having a first major surface for facing said microelectronic element and a second major surface, said body including at least one hole extending between said first and second major, surfaces, a generally laminar first contact secured to said first major surface of said body having an opening in registration with said hole, said first contact including at least one projection overlying a portion of said hole, said opening constructed for receiving a bump lead on said microelectronic element without engagement with said projection, whereby a said microelectronic element can be mounted, to said connector by superimposing said microelectronic element on said first major surface of said body so that said bump lead protrudes through said opening into said hole and upon lateral movement of said bump lead within said hole engages said projection for electrical connection thereto.
Dependencies are inferred from the claim text.