Flexible optical circuit appliques
Assignee3M Innovative Properties Company
InventorsMichael Alan Meis, Gordon Dwight Henson, Terry Lee Smith, Robert Travis Smith, Dewain Robert Goff
Life of this patent
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Abstract
A preformed fiber optic applique having a backing layer is provided. The backing layer or film has an adhesive coating applied thereon. At least one optical fiber is routed and bonded to the adhesive layer providing a continuous optical signal path from one end to another. A releasable liner is releasably attached to the adhesive layer and positioned to cover the backing layer including the at least one optical fiber. Microstructures are provided on the backing layer in one embodiment. The microstructures are crushable structures that prevent the adhesive from immediately adhering to a substrate.
Claims18
An electronic circuit comprising:
- a generally rigid electronic circuit substrate;
- and
- a preformed fiber optic applique mounted directly to the substrate, the applique including:
- a backing layer;
- a temporarily repositionable adhesive;
- and
- at least one optical fiber bonded to the backing layer by the temporarily repositionable adhesive;
- wherein the temporarily repositionable adhesive bonds at least a portion of the applique directly to the substrate.
An electronic circuit comprising:
- an electronic circuit board;
- a preformed fiber optic applique mounted to the electronic circuit board, the applique including:
- at least one backing layer,
- at least one adhesive layer,
- at least one optical fiber mounted to the backing layer;
- wherein the adhesive layer bonds at least a portion of the backing layer to the electronic circuit board, the adhesive layer further including microstructures.
An electronic circuit comprising:
- an electronic circuit board;
- a preformed fiber optic applique mounted to the electronic circuit board, the applique including:
- at least one backing layer,
- at least one adhesive layer,
- at least one optical fiber mounted to the backing layer;
- wherein the adhesive layer bonds at least a portion of the backing layer to the electronic circuit board, the backing layer further including microstructures.
An electronic circuit comprising:
- an electronic circuit board;
- a preformed fiber optic applique mounted to the electronic circuit board, the applique including:
- at least one backing layer,
- at least one adhesive layer,
- at least one optical fiber mounted to the backing layer;
- wherein the adhesive layer bonds at least a portion of the backing layer to the electronic circuit board, the electronic circuit board being a printed circuit board including electronic devices and wherein the applique further includes at least one connector, wherein the at least one optical fiber is terminated into the connector and the electronic devices couple to the connector.
An electronic circuit comprising:
- an electronic circuit board;
- a preformed fiber optic applique mounted to the electronic circuit board, the applique including:
- at least one backing layer,
- at least one adhesive layer,
- at least one optical fiber mounted to the backing layer;
- wherein the adhesive layer bonds at least a portion of the backing layer to the electronic circuit board, including a plurality of fiber optic appliques arranged in multiple layers.
An electronic circuit comprising:
- an electronic circuit board;
- a preformed fiber optic applique mounted to the electronic circuit board, the applique including:
- at least one backing layer,
- at least one adhesive layer,
- at least one optical fiber mounted to the backing layer;
- wherein the adhesive layer bonds at least a portion of the backing layer to the electronic circuit board,
- wherein the adhesive layer includes partially cured adhesives containing crushable mircostructures with curing catalyst inside.
An electronic circuit comprising:
- an electronic circuit board;
- a preformed fiber optic applique mounted to the electronic circuit board, the applique including:
- at least one backing layer,
- at least one adhesive layer,
- at least one optical fiber mounted to the backing layer;
- wherein the adhesive layer bonds at least a portion of the backing layer to the electronic circuit board,
- wherein the optical fiber includes a glass fiber having a diameter of 80 to 100 microns and the fibers are placed in optical paths having bend radii less than or equal to about 0.8 cms.
A method of manufacturing an electronic circuit, the method comprising the steps of:
- providing at least one optical circuit appliqué comprising
- a backing material
- a temporarily repositionable adhesive coated on the backing material, and
- optical fibers bonded to the backing material via the adhesive;
- and applying the at least one optical circuit appliqué to the electronic circuit substrate.
Dependencies are inferred from the claim text.