Method for manufacturing semiconductor chips using protecting pricing and separating sheets
AssigneeTokyo Seimitsu Co., Ltd.
InventorShigeharu Arisa
Life of this patent
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Abstract
The reverse of a wafer is processed after adhering a protecting sheet and a reinforcing plate to the obverse of a wafer. The wafer is mounted on a frame for dicing via a dicing sheet and diced. Then, the protecting sheet is separated from the wafer after irradiating the wafer with ultraviolet light.
Claims6
A method for manufacturing a plurality of chips from a wafer, a plurality of semiconductor devices being formed on an obverse of the wafer, comprising the steps in the following order:
- adhering a protecting sheet with an adhesive on the obverse of the wafer;
- then
- performing, with respect to a reverse of the wafer, at least one of grinding, polishing, and etching;
- then
- adhering a dicing sheet on the reverse of the wafer and mounting the wafer on a dicing frame;
- then
- dicing the wafer and the protecting sheet adhered to the wafer into a plurality of pieces with a dicing saw while the dicing sheet is adhered to the wafer;
- then
- hardening the adhesive so as to weaken adherence between the pieces of the protective sheet and the obverse of the wafer;
- then
- adhering a separating sheet, for removal of the pieces of the protecting sheet which has been cut by the dicing saw, over a top face of the protecting sheet;
- and then
- removing all of the pieces of the protecting sheet from the obverse of the pieces of the wafer together with the separating sheet while the pieces of the wafer remain adhered to the dicing sheet.
A method for manufacturing a plurality of chips from a wafer, a plurality of semiconductor devices being formed on an obverse of the wafer, comprising the steps in the following order:
- adhering a protecting sheet with a first adhesive on the obverse of the wafer;
- then
- adhering a reinforcing plate with a second adhesive on a top face of the protecting sheet;
- then
- performing, with respect to a reverse of the wafer, at least one of grinding, polishing, and etching;
- then
- adhering a dicing sheet on the reverse of the wafer and mounting the wafer on a dicing frame;
- then
- dicing the wafer, with the protecting sheet and the reinforcing plate, into a plurality of pieces with a dicing saw;
- then
- hardening the first adhesive so as to weaken adherence between the pieces of the protective sheet and the obverse of the pieces of the wafer;
- then
- adhering a separating sheet, for removal of the pieces of the protecting sheet which has been cut by the dicing saw, over a top face of the reinforcing plate;
- and then
- removing all of the pieces of the protecting sheet and the reinforcing plate from the obverse of the pieces of the wafer together with the separating sheet while the pieces of the wafer remain adhered to the dicing sheet.
Dependencies are inferred from the claim text.