Adhesive film for electronic parts
AssigneeTomoegawa Paper Co., Ltd.
InventorsHitoshi Narushima, Toshihiro Nakajima
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Abstract
The present invention provides an adhesive film for electronic parts, for example, an adhesive agent in a tape BGA (Ball Grid Array) or μ-BGA (trade name) package, in which embedding and adhesion to copper patterns on circuit boards are excellent, in which feeding and punching quality in the film state are superior, and which can reduce stress caused by thermal expansion difference between a circuit board and a reinforcing metal board or an IC chip. Adhesive film for electronic parts comprises a resin layer in which the dynamic modulus of elasticity at −30 to 125° C. is from 1 to 30 MPa and adhesive layers are coated on surfaces of the resin layer.
Claims16
Adhesive film for electronic parts comprising:
- a resin layer having a dynamic modulus of elasticity at −30 to 125° C. of from 1 to 30 MPa, and
- an adhesive layer provided on both surfaces of said resin layer.
Adhesive film for electronic parts comprising:
- a resin layer which comprises at least one resin selected from the group consisting of butadiene rubber, butyl rubber and silicon resin, and
- an adhesive layer provided on both surfaces of said resin layer.
Dependencies are inferred from the claim text.