Semiconductor chip having a radio-frequency identification transceiver
AssigneeAmkor Technology, Inc.
InventorsThomas P. Glenn, Steven Webster
Life of this patent
Estimating the term…
Abstract
A miniature radio-frequency identification (RFID) transceiver and a method for making the same are provided. The RFID transceiver is small in size and physically rugged. The RFID transceiver includes an integrated circuit and a radio-frequency antenna that is fixed to the integrated circuit and electrically connected to the integrated circuit. The integrated circuit includes an RFID transceiver circuit. The antenna may be a single thin-film layer over the top surface of the integrated circuit or multiple layers that form a larger antenna in a compact, folded structure. Multiple antenna layers may also be used to form a three-dimensional structure for improved antenna operation or may be used to form separate, independent antennas.
Claims21
A miniature radio-frequency identification (RFID) transceiver, comprising:
- an integrated circuit including an RFID transceiver circuit and a first contact area on a top surface of the integrated circuit, said contact area being in electrical communication with the RFID transceiver circuit;
- a first electrically insulating layer deposited over said top surface of the integrated circuit, said first electrically insulating layer including a hole exposing said first contact area;
- a first antenna layer formed on said first insulating layer, said first insulating layer providing electrical insulation between said top surface of said integrated circuit and said first antenna layer, said first antenna layer including a patterned layer of an electrically conductive material, wherein the electrically conductive material integrally fills said hole and makes electrical contact with said first contact area.
A method for producing a miniature radio-frequency identification (RFID) transceiver, the method comprising:
- providing an integrated circuit having a top surface, an internal RFID transceiver circuit and a first contact area at said top surface and in electrical communication with the RFID transceiver circuit;
- depositing a first electrically insulating layer over the top surface of said integrated circuit;
- forming a first hole through the first electrically insulating layer to expose the first contact area;
- forming a patterned, electrically conductive first antenna layer of a first electrically conductive material over said first electrically insulating layer, said first electrically conductive material integrally filling said first hole and forming an electrical contact with the first contact area.
Dependencies are inferred from the claim text.