Porous materials
AssigneeShipley Company, L.L.C.
InventorsCraig S. Allen, Nikoi Annan, Robert M. Blankenship, Michael K. Gallagher, Robert H. Gore, Angelo A. Lamola, Yujian You
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Abstract
Porous dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous dielectric materials.
Claims29
A method of preparing porous dielectric materials comprising the steps of:
- a) dispersing removable cross-linked polymeric porogen particles having a mean particle size of 1 to 200 nm in a polymerizable B-staged dielectric material;
- b) curing the B-staged dielectric material to form a dielectric matrix material without substantially degrading the porogen particles;
- and
- c) subjecting the dielectric matrix material to conditions which at least partially remove the porogen particles to form a porous dielectric material without substantially degrading the dielectric material;
- wherein the porogen particles are soluble in the B-staged dielectric material, wherein the polymeric porogen particles contain from 1 to 100% cross-linking agent based on the weight of the porogen and wherein the porogen particles are not reacted with the B-staged dielectric material.
A composition comprising a polymerizable B-staged dielectric material and cross-linked polymeric porogen particles having a mean particle size of 1 to 20 nm wherein the porogen particles are soluble in the B-staged dielectric material, wherein the polymeric porogen particles are prepared by emulsion polymerization and contain from 1 to 100% cross-linking agent based on the weight of the porogen and wherein the porogen particles are not reacted with the B-staged dielectric material.
A composition comprising a polymerizable B-staged dielectric material and cross-linked polymeric porogen particles having a mean particle size of 1 to 1000 nm wherein the porogen particles are soluble in the B-staged dielectric material, wherein the polymeric porogen particles are prepared by solution polymerization and contain from 1 to 100% cross-linking agent based on the weight of the porogen and wherein the porogen particles are not reacted with the B-staged dielectric material.
A method of preparing porous dieletric materials comprising the steps of:
- a) dispersing removable cross-linked polymeric porogen particles in a polymerixale B- staged dielectric material comprising hydrogensilsesquioxane;
- b) curing the B-staged dieletric material to form a dielectric material without substantially degrading the porogen particles;
- and
- c) subjecting the dielectricm matrix material imto conditions which at least partiallty remove the porogen particles to form a poroud dilectric material without substantially degrading the diletric material;
- wherein the polymeric porogen particles have a mean particle size of 1 to 1000 nm, contain from 1 to 100% cross-linking agent based on the weight of the porogen and are soluble in the B-staged dielectric material.
A composition comprising a polymerizable B-staged dielectric material comprising hydrogen silsequioxane and cross-linked polymeric porogen particles having a mean particle size of 1 to 1000 nm wherein the polymeric porogen particles contain from 1 to 100% cross-linking agent based on the weight of the porogen and wherein the porogen particles are soluble in the B-staged dielectric material.
Dependencies are inferred from the claim text.