US 6,413,153 B1 · Finishing element including discrete finishing members

Abstract

Unitary finishing elements having discrete finishing members fixedly attached to unitary resilient body are disclosed for finishing semiconductor wafers. The discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

Claims76

Dependent claims

A unitary finishing element having a plurality of discrete finishing members for finishing a semiconductor wafer surface comprising:

discrete finishing members wherein:
each discrete finishing member has a surface area of less than the surface area of the semiconductor wafer surface being finished;
each discrete finishing member has a discrete finishing member finishing surface and a finishing member body;
each finishing member body is comprised of a continuous region of higher flexural modulus organic synthetic resin;
and
a ratio of the shortest distance across in centimeters of the discrete finishing member body to the thickness in centimeters of each discrete finishing member body is at least 10/1;
a unitary resilient body comprised of an organic polymer wherein the unitary resilient body has a plurality of discrete finishing members fixedly attached to the unitary resilient body in such a manner that each discrete finishing member is separate from its nearest discrete finishing member;
and
the unitary resilient body of organic polymer has a lower flexural modulus than the higher flexural modulus organic synthetic resin in the finishing member body.

6 more elements

A unitary finishing element having a plurality of discrete finishing members for finishing a semiconductor wafer having a plurality of dies comprising:

a plurality of discrete finishing members wherein:
each discrete finishing member has a discrete finishing member finishing surface and a finishing member body;
each finishing member body is comprised of a continuous region of material having a higher flexural modulus;
and
each discrete finishing member finishing surface has a surface area of less than the surface area of the semiconductor wafer being finished and more than the die surface area;
a uniary resilient body comprised of an organic polymer and wherein the unitary resilient body has the plurality of separate and distinct finishing members fixedly attached to the unitary resilient body;
and wherein
the unitary resilient body of organic polymer having a lower flexural modulus than the higher flexural modulus material in the finishing member body;
and
the discrete finishing members are separated from their nearest discrete finishing member neighbor by at least ½ times the thickness of the discrete finishing member thickness in centimeters.

7 more elements

A method of finishing a semiconductor wafer being finished with a unitary finishing element having a plurality of discrete finishing members comprising the steps of:

providing a unitary finishing element comprising:
the plurality of discrete finishing members wherein:
each discrete finishing member has a surface area of less than the surface area of the semiconductor wafer being finished;
each discrete finishing member has a discrete finishing member finishing surface and a finishing member body;
and
each finishing member body is comprised of a continuous region of material having a higher flexural modulus;
a unitary resilient body comprised of an organic polymer and wherein the unitary resilient body has the plurality of separate and distinct finishing members fixedly attached to the unitary resilient body;
and
the unitary resilient body of organic polymer has a lower flexural modulus than the higher flexural modulus material in the finishing member body;
positioning the semiconductor wafer being finished proximate to the unitary finishing element with a finishing element support;
applying an operative finishing motion with a finishing pressure between the semiconductor wafer surface being finished and the discrete finishing members in the unitary finishing element;
and
finishing at a higher finishing rate measured in angstroms per minute on a plurality of higher local regions as compared to a plurality of low local regions proximate to the higher local regions on the semiconductor wafer surface being finished.

10 more elements

A process for finishing a semiconductor wafer surface with a multiphase polymeric composition, the multiphase polymeric composition comprising:

a multiphase synthetic polymer composition having:
a continuous phase of synthetic polymer “A”;
discrete particles comprising synthetic polymer “B” dispersed in the continuous phase of synthetic polymer “A”;
and
wherein the synthetic polymer “A” is dynamically reacted with the synthetic polymer “B” forming a multiphase polymeric mixture with higher Ultimate Tensile Strength as measured by ASTM D 638 than that of the same multiphase polymeric mixture in the absence of a dynamic reaction between the two synthetic polymers;
and
wherein the mulfiphase composition has at least two distinct glass transition temperatures;
and the process for finishing comprises the steps of:
applying the multiphase polymeric composition to a semiconductor wafer surface;
and
operatively finishing a semiconductor wafer with the multiphase polymeric composition.

8 more elements

A process for finishing a semiconductor wafer surface with a multiphase polymeric composition, the multiphase polymeric composition comprising:

a multiphase synthetic polymer composition having:
a continuous phase of synthetic polymer “A”;
discrete particles comprising synthetic polymer “B” dispersed in the continuous phase of thermoplastic synthetic polymer “A” and wherein synthetic polymer “B” comprises a polymer selected from the group consisting of polyurethanes, polyolefins, polyesters, polyamides, polystyrenes, polycarbonates, polyvinyl chlorides, polyimides, epoxies, chloroprene rubbers, ethylene propylene elastomers, butyl polymers, polybutaienes, polyisoprenes, EPDM elastomers,, and styrene butadiene elastomers;
and
wherein the synthetic polymer “A” is dynamically reacted with the synthetic polymer “B” forming a multiphase polymeric mixture with a higher Fatigue Endurance as measured by ASTM D 671 than that of the same multiphase polymeric mixture in the absence of the a dynamically reaction between the two synthetic resins is preferred;
and
wherein the multiphase composition has at least two distinct glass transition temperatures;
and the process for finishing comprises the steps of:
applying the multiphase polymeric composition to a semiconductor wafer surface;
and
operatively finishing a semiconductor wafer with the multiphase polymeric composition.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/556,509Filed 24 Apr 2000 · us provisional application

Priority

26 Apr 1999

Granted

2 Jul 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

B24B 37/24
Lapping pads for working plane surfaces: characterised by the composition or properties of the pad materials
B24D 3/28
And being essentially organic: resins or natural or synthetic macromolecular compounds
B24D 7/063
With inserted abrasive blocks, e.g. segmental: with segments embedded in a matrix which is rubbed away during the grinding process
B24B
Machines, devices, or processes for grinding or polishing

Family

Application60/131,016Us provisional application · filed 26 Apr 1999

Application60/132,329Us provisional application · filed 3 May 1999

Application60/136,954Us provisional application · filed 1 Jun 1999

Application60/141,302Us provisional application · filed 28 Jun 1999

Application60/141,304Us provisional application · filed 28 Jun 1999

Application60/158,797Us provisional application · filed 12 Oct 1999

US 6,413,153 B1This patent

From the US filing history. Foreign family members aren’t listed.

Abstract

Claims76

Dependent claims

A unitary finishing element having a plurality of discrete finishing members for finishing a semiconductor wafer surface comprising:

discrete finishing members wherein:
each discrete finishing member has a surface area of less than the surface area of the semiconductor wafer surface being finished;
each discrete finishing member has a discrete finishing member finishing surface and a finishing member body;
each finishing member body is comprised of a continuous region of higher flexural modulus organic synthetic resin;
and
a ratio of the shortest distance across in centimeters of the discrete finishing member body to the thickness in centimeters of each discrete finishing member body is at least 10/1;
a unitary resilient body comprised of an organic polymer wherein the unitary resilient body has a plurality of discrete finishing members fixedly attached to the unitary resilient body in such a manner that each discrete finishing member is separate from its nearest discrete finishing member;
and
the unitary resilient body of organic polymer has a lower flexural modulus than the higher flexural modulus organic synthetic resin in the finishing member body.

6 more elements

A unitary finishing element having a plurality of discrete finishing members for finishing a semiconductor wafer having a plurality of dies comprising:

a plurality of discrete finishing members wherein:
each discrete finishing member has a discrete finishing member finishing surface and a finishing member body;
each finishing member body is comprised of a continuous region of material having a higher flexural modulus;
and
each discrete finishing member finishing surface has a surface area of less than the surface area of the semiconductor wafer being finished and more than the die surface area;
a uniary resilient body comprised of an organic polymer and wherein the unitary resilient body has the plurality of separate and distinct finishing members fixedly attached to the unitary resilient body;
and wherein
the unitary resilient body of organic polymer having a lower flexural modulus than the higher flexural modulus material in the finishing member body;
and
the discrete finishing members are separated from their nearest discrete finishing member neighbor by at least ½ times the thickness of the discrete finishing member thickness in centimeters.

7 more elements

A method of finishing a semiconductor wafer being finished with a unitary finishing element having a plurality of discrete finishing members comprising the steps of:

providing a unitary finishing element comprising:
the plurality of discrete finishing members wherein:
each discrete finishing member has a surface area of less than the surface area of the semiconductor wafer being finished;
each discrete finishing member has a discrete finishing member finishing surface and a finishing member body;
and
each finishing member body is comprised of a continuous region of material having a higher flexural modulus;
a unitary resilient body comprised of an organic polymer and wherein the unitary resilient body has the plurality of separate and distinct finishing members fixedly attached to the unitary resilient body;
and
the unitary resilient body of organic polymer has a lower flexural modulus than the higher flexural modulus material in the finishing member body;
positioning the semiconductor wafer being finished proximate to the unitary finishing element with a finishing element support;
applying an operative finishing motion with a finishing pressure between the semiconductor wafer surface being finished and the discrete finishing members in the unitary finishing element;
and
finishing at a higher finishing rate measured in angstroms per minute on a plurality of higher local regions as compared to a plurality of low local regions proximate to the higher local regions on the semiconductor wafer surface being finished.

10 more elements

A process for finishing a semiconductor wafer surface with a multiphase polymeric composition, the multiphase polymeric composition comprising:

a multiphase synthetic polymer composition having:
a continuous phase of synthetic polymer “A”;
discrete particles comprising synthetic polymer “B” dispersed in the continuous phase of synthetic polymer “A”;
and
wherein the synthetic polymer “A” is dynamically reacted with the synthetic polymer “B” forming a multiphase polymeric mixture with higher Ultimate Tensile Strength as measured by ASTM D 638 than that of the same multiphase polymeric mixture in the absence of a dynamic reaction between the two synthetic polymers;
and
wherein the mulfiphase composition has at least two distinct glass transition temperatures;
and the process for finishing comprises the steps of:
applying the multiphase polymeric composition to a semiconductor wafer surface;
and
operatively finishing a semiconductor wafer with the multiphase polymeric composition.

8 more elements

A process for finishing a semiconductor wafer surface with a multiphase polymeric composition, the multiphase polymeric composition comprising:

a multiphase synthetic polymer composition having:
a continuous phase of synthetic polymer “A”;
discrete particles comprising synthetic polymer “B” dispersed in the continuous phase of thermoplastic synthetic polymer “A” and wherein synthetic polymer “B” comprises a polymer selected from the group consisting of polyurethanes, polyolefins, polyesters, polyamides, polystyrenes, polycarbonates, polyvinyl chlorides, polyimides, epoxies, chloroprene rubbers, ethylene propylene elastomers, butyl polymers, polybutaienes, polyisoprenes, EPDM elastomers,, and styrene butadiene elastomers;
and
wherein the synthetic polymer “A” is dynamically reacted with the synthetic polymer “B” forming a multiphase polymeric mixture with a higher Fatigue Endurance as measured by ASTM D 671 than that of the same multiphase polymeric mixture in the absence of the a dynamically reaction between the two synthetic resins is preferred;
and
wherein the multiphase composition has at least two distinct glass transition temperatures;
and the process for finishing comprises the steps of:
applying the multiphase polymeric composition to a semiconductor wafer surface;
and
operatively finishing a semiconductor wafer with the multiphase polymeric composition.

8 more elements

Dependencies are inferred from the claim text.

Finishing element including discrete finishing members

Life of this patent

Abstract

Claims76

Finishing element including discrete finishing members

Life of this patent

Abstract

Claims76