Center bond flip chip semiconductor carrier and a method of making and using it
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Alan G. Wood
Life of this patent
Estimating the term…
Abstract
A center bond flip chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a plurality of conductive traces. A cut out portion is formed in each trace at a position within a gap of a layer of elastomeric material provided over the traces. Each cut out portion is sized and configured to receive a solder ball for electrically connecting the carrier with a semiconductor die.
Claims46
A carrier for a semiconductor device, comprising:
- a substrate;
- at least one conductive trace located on said substrate, said trace including a seat having a cut out portion sized and configured to receive a conductive connecting structure for interconnection between the conductive trace and a chip;
- external connecting structures for mounting the carrier to a printed circuit board;
- and
- an elastomeric covering material, said material including a gap at a location corresponding to said seat.
A carrier for a semiconductor device, comprising:
- a substrate;
- a plurality of elongated conductive traces located on said substrate, said traces each including a seat having a cut out portion sized and configured to receive a solder ball for interconnection between the traces and a chip, wherein said seats inhibit wicking of the solder balls along the conductive traces;
- an elastomeric covering material, said material including a gap at a location separating a first portion of said material from a second portion of said material and corresponding to said seat.
A semiconductor device comprising a semiconductor die electrically connected to a carrier, said carrier comprising:
- a substrate;
- at least one conductive trace located on said substrate, said trace including a seat having a cut out portion sized and configured to receive a conductive connecting structure for interconnection between the conductive trace and a chip, said cut out portion including a side wall between a pair of open ends;
- and
- an elastomeric covering material, said material including a gap corresponding to said seat.
An electronic system, comprising:
- a semiconductor die;
- and
- a die carrier supporting said die, said die carrier comprising:
- a substrate;
- a plurality of conductive traces located on said substrate, each said trace including a seat having a cut out portion receiving a conductive connecting structure which interconnects the conductive trace and the die;
- external connecting structures electrically coupled to said plurality of conductive traces for mounting the carrier to a printed circuit board;
- and
- an elastomeric covering material, said material including a gap corresponding to said seats, wherein said traces are permanently electrically connected with said semiconductor die through a respective conductive connecting structure provided within said gap.
A carrier for a semiconductor device, comprising:
- a substrate;
- at least one elongated conductive trace located on said substrate, said trace including a seat having a cut out portion sized and configured to receive a solder ball for interconnection between the conductive trace and a chip, wherein said seats inhibit wicking of the solder balls along the conductive traces;
- and
- a covering material deposited upon and permanently affixed to said substrate, said material including a gap at a location corresponding to said seat, wherein said solder ball is in electrical connection with said trace at said seat.
Dependencies are inferred from the claim text.