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US 6,410,979 B1Granted
Ball-grid-array semiconductor device with protruding terminals
AssigneeNEC Corporation
InventorMasaaki Abe
Life of this patent
Estimating the term…
Abstract
There is provided a ball-grid-array semiconductor device. The semiconductor device has a semiconductor element sealed with a resin material. In addition, a lead frame is connected to the semiconductor element in the resin material. The lead frame is provided with terminal portions that protrude through the surface of the resin material.
Claims16
A ball-grid-array semiconductor device comprising:
- a semiconductor element;
- a resin material which seals said semiconductor element and has a bottom surface and leg portions extending below said bottom surface, said leg portions being arranged in parallel rows and said bottom surface existing at least between said parallel rows of said leg portions;
- and
- a lead frame formed of a single material and connected to said semiconductor element in said resin material, said lead frame having a bottom surface and a terminal portion for connecting to a substrate, said terminal portion extending below said bottom surface of said lead frame and protruding through a bottom surface of one of said leg portions,
- wherein said leg portions elevate said semiconductor device above said substrate so that said bottom surface of said resin material is separated from a surface of said substrate by a space having a height which is at least a length of said leg portions.
2 more elements
A ball-grid-array semiconductor device comprising:
- a semiconductor element;
- a resinous coating on said semiconductor element, having a bottom surface and leg portions extending below said bottom surface, said leg portions being arranged in parallel rows and said bottom surface existing at least between said parallel rows of said leg portions;
- and
- a lead frame connected to said semiconductor element in said resinous coating, said lead frame having a bottom surface and a terminal portion for connecting to a subtstrate, said terminal portion extending below said bottom surface of said lead frame and protruding through a bottom surface of one of said leg portions,
- wherein said leg portions elevate said semiconductor device so that said bottom surface of said resinous coating is separated from said substrate by a space having a height which is at least a length of said leg portions.
2 more elements
Dependencies are inferred from the claim text.