Apparatus and method for reviewing defects on an object

A method of reviewing defects on an object surface, based on a previously generated defect map, the method comprising the steps:

• viewing selected portions of the object surface with an optical microscope, based on coordinates from a defect map, to redetect the defects;
• determining stage coordinates corresponding to the location of the redetected defects;
• calculating reporting error from said defect map and said stage coordinates;
• moving the object surface to position the redetected defects proximate a focal point of a particle beam imaging system;
• and
• reviewing the redetected defects using the particle beam imaging system.

A method of inspecting a surface of a wafer for defects using electron-beam microscope, comprising:

• generating a list of designated areas on the wafer to be inspected;
• providing the list of designated areas to the microscope to perform scanning with electron beam of the designated areas;
• performing a die-to-die inspection to detect defects in the designated areas;
• and, construct an e-based defect map.