Process for fabricating organic semiconductor device involving selective patterning

Abstract

An improved process for forming devices utilizing patterned organic semiconductor films is provided. The process involves treating a surface to selectively provide regions of greater affinity and lesser affinity for an organic semiconductor or an organic semiconductor solution. When the organic semiconductor, or solution comprising the semiconductor, is deposited on the treated surface, either the organic semiconductor or the organic semiconductor solution dewets from the lesser affinity regions or the resultant film adheres only weakly to the lesser affinity regions such that selective removal is readily performed. And even where such removal is not performed, the portions of the organic semiconductor film overlying the greater affinity regions exhibit higher mobility and better film continuity relative to the other portions of the film.

Dependencies are inferred from the claim text.