Mold clamping device with improved clamping force transmission mechanism
OwnerToshinobu Banjyo, Masataka Takehara +2inventors
InventorsToshinobu Banjyo, Masataka Takehara, Shinichi Hasegawa, Haruo Yoshida
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OwnerToshinobu Banjyo, Masataka Takehara +2inventors
InventorsToshinobu Banjyo, Masataka Takehara, Shinichi Hasegawa, Haruo Yoshida
Estimating the term…
The mold clamping device with improved transmission mechanism includes: a middle platen 2 fixedly supported by a support base 1 and carrying the lower metallic mold 6; and front tie-bars 3a extending slidably therethrough. A movable platen 4 carrying the upper metallic mold 7 is secured to the top ends of the front tie-bars 3a. The horizontal connecting bar members 5a and 5b connect the bottom ends of the front and the rear tie-bars 3a and 3b. The middle platen 2 and the horizontal connecting bar members 5a and 5b are operatively coupled by means of the pantograph mechanism consisting of flat bar-shaped links 15a and 15b, whose front and rear joints are pinned to annular links 16a and 16bengaging with a left-and-right-handed ball thread member 17 driven by a driving source.
A mold clamping device for sealing a semiconductor element with a resin, comprising:
A mold clamping device for sealing a semiconductor element with a resin, comprising:
Dependencies are inferred from the claim text.