Method and apparatus to reduce EMI leakage through an isolated connector housing using capacitive coupling
AssigneeIntel Corporation
InventorBrad Bickford
Life of this patent
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Abstract
A capacitive coupling includes a capacitive material and a conductor coupled to the capacitive material. The conductor and the capacitive material have a form factor to fixedly attach to either a connector housing or a chassis of an electronic device. The form factor of the conductor and the capacitive material is also to removably couple the connector housing and the chassis of the electronic device such that at least one signal frequency is passed between the connector housing and the chassis of the electronic device and a direct current is isolated between the connector housing and the chassis of the electronic device.
Claims14
A capacitive coupling comprising:
- a capacitive material;
- and
- a conductor coupled to the capacitive material, said conductor and said capacitive material having a form factor to fixedly attach to a connector housing, and having a compressible design to compressibly mate with a chassis of an electronic device and to removably couple the connector housing and the chassis of the electronic device such that at least one signal frequency is passed between the connector housing and the chassis of the electronic device and a direct current is isolated between the connector housing and the chassis of the electronic device.
A method comprising:
- fixedly attaching a capacitive material to a connector housing, said capacitive material having a conductor coupled there to;
- compressibly mating the conductor and a chassis of an electronic device, said conductor having a compressible design to compressibly mate with the chassis of the electronic device;
- and
- removably coupling the connector housing and the chassis of the electronic device through the capacitive material and the conductor such that at least one signal frequency is passed between the connector housing and the chassis of the electronic device and a direct current is isolated between the connector housing and the chassis of the electronic device.
An apparatus comprising:
- capacitive means;
- and
- means for conducting coupled to the capacitive means, said means for conducting and said capacitive means having a form factor for fixedly attaching to a connector housing, and having a compressible design to compressibly mate with a chassis of an electronic device and for removably coupling the connector housing to the chassis of the electronic device such that at least one signal frequency is passed between the connector housing and the chassis of the electronic device and a direct current is isolated between the connector housing and the chassis of the electronic device.
Dependencies are inferred from the claim text.