Cooling system with auxiliary thermal buffer unit for cooling an electronics module

A cooled processing stack comprising:

• an electronics module having a main surface;
• a cooling system thermally coupled to the main surface of the electronics module, said cooling system comprising:
• a cooling unit;
• an evaporator plate having at least one isolated refrigerant loop therein for receiving coolant from the cooling unit;
• and
• a thermal buffer, said thermal buffer being thermally coupled to the evaporator plate to maintain temperature of the evaporator plate within a predefined range for a period of time upon shut down or failure of the cooling unit.

A method of fabricating a cooling system for an electronics module, said method comprising:

• providing a refrigeration cooled cold plate;
• thermally coupling a thermal buffer unit to said refrigeration cooled cold plate;
• and
• thermally coupling said refrigeration cooled cold plate to said electronics module for removing heat generated by the electronics module, wherein said thermal buffer unit is thermally coupled to said electronics module across said refrigeration cooled cold plate for auxiliary cooling of said electronics module upon shut down or failure of said refrigeration cooled cold plate.