Microjoinery methods and devices
AssigneeThe Regents of the University of California
InventorScott D. Collins
Life of this patent
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Abstract
A wafer level interconnecting mechanism for assembling and packaging multiple MEMS devices (modules), using microfabricated, interlocking, mechanical joints to interconnect different modules and to create miniature devices. Various devices can be fabricated using these joints, including fiber-optic switches, xyz translational stages, push-n-lock locking mechanisms, slide-n-lock locking mechanisms, t-locking joints, fluidic interconnects, on/off valves, optical fiber couplers with xy adjustments, specimen holders, and membrane stops.
Claims12
A method of fabricating a microjoint, comprising:
- depositing and patterning an etch mask on a first (100) silicon wafer;
- anisotropically etching said first (100) silicon wafer to a desired depth;
- stripping said etch mask;
- bonding said first (100) silicon wafer to a second wafer to form a wafer assembly;
- thinning said first (100) silicon wafer to expose a microjoint element;
- dicing said wafer assembly to form complementary mechanically interlocking microjoint elements;
- and
- sliding said microjoint elements together until said microjoint elements interlock to form a microjoint that constrains movement between said microjoint elements.
A method of fabricating a microjoint, comprising:
- depositing and patterning an etch mask on a first silicon wafer;
- anisotropically etching said first silicon wafer to a desired depth;
- stripping said etch mask;
- bonding said first silicon wafer to a second wafer to form a wafer assembly;
- thinning said first silicon wafer to expose a microjoint element;
- dicing said wafer assembly to form complementary mechanically interlocking microjoint elements;
- and
- sliding said microjoint elements together until said microjoint elements interlock to form a microjoint that constrains movement between said microjoint elements.
Dependencies are inferred from the claim text.