Method of forming through-holes in a wafer and then dicing to form stacked semiconductor devices
AssigneeRohm Co., Ltd.
InventorsJunichi Hikita, Kazutaka Shibata, Shigeyuki Ueda
Life of this patent
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Abstract
A semiconductor chip in which a through hole penetrating through its surface and reverse surface is formed in a scribe line region in the vicinity of an active region where a functional device is formed, and a conductive member is arranged in the through portion. The through portion may be a groove opening sideward on a sidewall surface of the semiconductor chip. The through portion may be a through hole blocked from a side part of the semiconductor chip. The semiconductor chip further includes wiring for electrically connecting an internal circuit formed in the active region and the conductive member to each other.
Claims6
A method of fabricating a semiconductor chip by cutting a semiconductor substrate along a scribe line, comprising the steps of:
- forming a through hole having an inner surface and penetrating through a forward surface and a reverse surface of the semiconductor substrate in a scribe line region that is a region in the vicinity of the scribe line on the semiconductor substrate;
- arranging a conductive member in the through hole;
- and
- supplying wiring for electrically connecting an internal circuit, formed in an active region on said forward surface of the semiconductor substrate, and said conductive member to each other,
- said wiring having a portion in the vicinity of the scribe line, the wiring portion being in direct contact with said forward surface of the semiconductor substrate.
A method of fabricating a semiconductor chip by cutting a semiconductor substrate, comprising the steps of:
- forming a resist film having an opening corresponding to a position where a through hole is to be formed;
- forming the through hole penetrating through a forward surface and a reverse surface of the semiconductor substrate;
- etching the semiconductor substrate using the resist film as a mask;
- and
- arranging a conductive member in the through hole using the resist film as a mask.
Dependencies are inferred from the claim text.