Finishing semiconductor wafers with a fixed abrasive finishing element
OwnerCharles J Molnarinventor
Life of this patent
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Abstract
A fixed abrasive finishing element having a continuous phase of synthetic resin and discrete synthetic resin particles dispersed in the continuous phase of synthetic resin is described. The synthetic resin particles have abrasive particles dispersed therein. A compatibilizing agent can be used to enhance their finishing properties. The finishing elements are useful for polishing semiconductor wafers. Planarization and localized finishing can be improved using these finishing elements. Unwanted surface defects can be reduced. Methods to finish a semiconductor wafer using these finishing elements are described.
Claims27
A method of finishing of a semiconductor wafer surface being finished comprising the steps of:
- a) providing an abrasive finishing element having an abrasive finishing surface and wherein the abrasive finishing surface comprises:
- a continuous phase comprising a synthetic resin polymer “A”;
- unconnected, discrete synthetic resin particles comprising a synthetic resin polymer “B” having-a plurality of abrasive particles dispersed therein, the discrete synthetic resin particles comprising the synthetic resin polymer “B” being dispersed in the continuous phase of synthetic resin polymer “A”;
- and
- a compatibilizing polymer “C” coupling the discrete synthetic resin polymer “B” particles with the continuous phase of the synthetic resin polymer “A”;
- and
- the synthetic resin polymer “B” has a different the flexural modulus than that of the synthetic resin polymer “A”;
- and wherein
- b) positioning the semiconductor wafer surface being finished proximate to the abrasive finishing surface;
- and
- c) applying an operative finishing motion between the semiconductor wafer surface being finished and the abrasive finishing surface wherein the discrete synthetic resin particles are in finishing contact with the semiconductor wafer surface being finished.
A finishing element having a synthetic resin layer for finishing a semiconductor wafer comprising:
- a continuous phase comprising a synthetic resin matrix comprising synthetic resin polymer composition “A”;
- and
- discrete synthetic resin particles comprising synthetic resin polymer composition “B” having abrasive particles therein;
- the discrete synthetic resin particles being dispersed in the continuous phase of synthetic resin polymer “A”;
- and
- a polymeric compatibilizing agent “C” for compatibilizing the polymer composition “A” and the polymer composition “B”;
- and wherein
- the Shore D hardness of the synthetic resin polymer “A” in the discrete synthetic resin particle is different than the Shore D hardness of the synthetic resin polymer “B”.
Dependencies are inferred from the claim text.