Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die
AssigneeIntel Corporation
InventorsMichael Z. Eckblad, Russell S. Aoki, Chia-Pin Chiu, Correy D. Cooks, Richard Zhao
Life of this patent
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Abstract
A method and assembly for utilizing a gasket to protect an exposed die from damage, such as chipping and cracking, caused by external forces such as shock, vibrations, installation and/or handling, as well as to prevent electromagnetic interference (EMI) emissions from the exposed die.
Claims24
A method for protecting an exposed die mounted on a substrate surface from structural damage caused by external forces, said method comprising the steps of:
- placing a gasket on said substrate surface, wherein said gasket has an opening which fits over said exposed die, and wherein said gasket has a greater height than said exposed die when said gasket is in a non-compressed state;
- concurrently or subsequently to said placing of said gasket, placing a die reference heat sink over said gasket and said exposed die such that said heat sink is not in contact with said exposed die;
- and
- compressing said gasket with said die reference heat sink to reduce the height of said gasket until a bottom surface of said heat sink contacts with a top surface of said exposed die.
A heat sink-gasket assembly, comprising:
- a die reference heat sink;
- a gasket;
- an exposed die mounted on a substrate surface;
- wherein said gasket has a central opening to fit over said exposed die on said substrate surface such that said gasket has a height greater than said exposed die when said gasket is in a non-compressed state;
- and
- wherein said gasket is compressed by said heat sink from a position where the heat sink is out of contact with said exposed die to a position reducing the height of said gasket until said heat sink contacts with a top surface of said exposed die.
An electromagnetic interference emissions suppressing system for an exposed die, comprising:
- a substrate surface upon which said exposed die is placed;
- a gasket having an opening which fits over said exposed die, said gasket having a greater height that that of said exposed die in a non-compressed state;
- a die reference heat sink;
- and
- wherein said gasket in combination with said substrate surface and said heat sink, forms a barrier to suppress electromagnetic interference (EMI) emissions from said exposed die, and
- wherein said gasket is compressed by said heat sink from a position where the heat sink is out of contact with said exposed die to a position reducing the height of said gasket until said heat sink contacts with a top surface of said exposed die.
A method for reducing EMI emissions from an exposed die mounted on a substrate surface, said method comprising the steps of:
- placing a gasket on said substrate surface, said gasket having an opening which fits over said exposed die, and said gasket having a greater height than that of said exposed die when said gasket is in a non-compressed state;
- concurrently or subsequently to said placing of said gasket, placing a die reference heat sink over said gasket and said die such that said heat sink is not in contact with said exposed die;
- and
- compressing said gasket with a bottom surface of said die reference heat sink to reduce the height of said gasket until the bottom surface of said heat sink contacts said exposed die.
Dependencies are inferred from the claim text.