Telecommunication main distribution frame structure

Telecommunication main distribution frame structure comprising a PC board, several pairs of insertion pins, four insertion seats, four buses, four corresponding insertion seats connected with one end of the buses and four connectors connected with the other end of the buses, the PC board, being formed with several insertion holes and soldering holes forming soldering sections for the insertion seats, the insertion holes being electrically connected with the soldering holes, the insertion seats being soldered at the soldering holes of the soldering sections of the PC board, said main distribution frame structure being characterized in that:

• the PC board is three-layered, having a left board, a middle board and a right boards integrally connected with each other, each of two openings of the insertion hole being provided with a circle of shallow conductive face, the insertion hole being longitudinally cut with a locating split to divide the conductive face into a left and a right halves, each of two openings of the soldering hole being provided with a shallow conductive face;
• the insertion pin is a rectangular column made of insulating material, each of two ends thereof being formed with a lip, a resilient well conductive plate being connected between the lip along the long side of the insertion pin;
• and
• the insertion pins are inserted into the insertion holes that the face with the conductive plate is aimed at the locating split of the insertion hole, whereby the conductive plate is resiliently pressed to electrical contact with a left side and a right side of the conductive face of the insertion hole.