Surface mount type package unit

A method for manufacturing a surface mount type package unit including a package body directly mounted on a circuit board with solder, the method comprising steps of:

• forming a first conductor on a mounted surface of the package body;
• forming a second conductor on the mounted surface of the package body to be in a non-contacting state with respect to the signal electrode;
• preparing the circuit board having a conductive member on a surface thereof;
• and
• bonding the first conductor and the second conductor of the package body to the conductive member of the circuit board by solder.

A surface mount type package unit comprising:

• a circuit board;
• a package body mounted on the circuit board, the package body having a mounted surface facing the circuit board and a secondary surface adjacent to the mounted surface, the secondary surface being non-parallel to the mounted surface;
• a circuit element held on the package body;
• a first conductor provided on the mounted surface of the package body to face the circuit board, and electrically connected to the circuit element;
• a first solder portion provided between the first conductor and the circuit board to make contact between the first conductor and the circuit board;
• a second conductor provided on the mounted surface of the package body to face the circuit board, and electrically insulated from the first conductor and the circuit board;
• and
• a second solder portion provided between the second conductor and the circuit board.