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US 6,388,798 B2Granted
Integrated circuit with opposed spatial light modulator and processor
AssigneeIntel Corporation
InventorsRonald D. Smith, Kannan Raj
Life of this patent
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Abstract
An integrated circuit may have a spatial light modulator formed on one side of a semiconductor support and a microprocessor formed on the opposite side. The microprocessor and the spatial light modulator may communicate with one another through electrical connections which extend completely through the semiconductor support. The microprocessor may be contacted using bump packaging techniques.
Claims8
A method comprising:
- forming a microprocessor on one side of an integrated circuit die;
- forming a spatial light modulator on the opposite side of said integrated circuit die;
- and
- electrically coupling said modulator and said processor through said die.
1 more element
Dependencies are inferred from the claim text.