Exposure apparatus with an anti-vibration structure
AssigneeNikon Corporation
InventorYutaka Hayashi
Life of this patent
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AssigneeNikon Corporation
InventorYutaka Hayashi
Estimating the term…
An exposure apparatus has an illumination optical system 37 an exposure machine main portion (29). The illumination optical system (37) includes, for example, a cooling fan (43) and mounted on an independent column (36) which is fixedly mounted on a floor (1). The exposure machine main portion (29) includes a reticle stage (27), a projection optical system (25), a wafer stage (20), first and second support columns (24 and 26) and a platen (6). The exposure machine main portion (29) is mounted on the floor (1) through height adjustors (3A-3D) and the associated vibration isolators (4A-4D) and capable of six-degree-of-freedom displacement by means of actuators (7A, 7B and 32A-32C). Capacitor type sensors (44A and 44B) are provided between the independent column (36) and the second column (26) for detecting any misalignment and the distance between the illumination optical system (37) and the exposure machine main portion (29). The relative position of the illumination optical system (37) and the exposure machine main portion (29) is controlled by a controller (11) based on the misalignment and the distance detected. In this manner, any vibrations and shakings of the illumination optical system as produced by the cooling fan for removing the heat generated in the exposure light source is transferred only to the independent column (36) and not to the exposure machine main portion (29), resulting in an enhanced alignment accuracy between the mask (reticle) and the photosensitized substrate (wafer).
An exposure apparatus for transferring a pattern formed on a mask onto a photosensitized substrate, comprising:
An exposure apparatus for transferring a pattern formed on a mask onto a photosensitized substrate through a projection optical system, comprising:
An exposure apparatus for transferring a pattern formed on a mask onto a photosensitive substrate, comprising:
A method of manufacturing an exposure apparatus for transferring a pattern formed on a mask onto a photosensitized substrate, comprising:
A method of manufacturing an exposure apparatus for transferring a pattern formed on a mask onto a photosensitized substrate through a projection optical system comprising:
A method of manufacturing an exposure apparatus for transferring a pattern formed on a mask onto a photosensitized substrate through a projection optical system comprising:
A method of manufacturing an exposure apparatus which has an illumination source which emits an illumination beam and a projection system which transfers a pattern formed on a mask onto a substrate, comprising:
A method of manufacturing an exposure apparatus which has an illumination source which emits an illumination beam and a projection system which transfers a pattern formed on a mask onto a substrate, comprising:
A method for manufacturing an exposure apparatus which has an illumination source which emits an illumination beam and a projection system which transfers a pattern formed on a mask onto a substrate, comprising:
An exposure apparatus which transfers a pattern of a mask onto an object, comprising:
Dependencies are inferred from the claim text.