Electrode plate, process for producing the plate, liquid crystal device including same and process for producing the device

A process for producing an electrode plate comprising the steps of:

• forming on a substrate a plurality of metal electrodes with gaps therebetween in a prescribed pattern,
• forming a rigid elongated metal projection in a continuous and closed frame along all peripheral sides of a rectangular mold substrate, said elongated metal projection having a thickness substantially identical to that of the metal electrodes but having a width larger than that of the metal electrodes,
• placing a resin between the substrate and the mold substrate,
• pressing the mold substrate provided with said elongated metal projection toward the substrate under a pressure sufficient to deform the resin but not deform said elongated metal projection, thereby filling the gaps with the resin while allowing an excess of the resin to flow out of the gaps between the metal electrodes, and
• curing the resin at the gaps between the metal electrodes,
• wherein said elongated metal projection is spaced from the metal electrodes so that a spacing between said elongated metal projection and an outermost metal electrode closest and parallel thereto is wider than a gap between adjacent metal electrodes thereby to fully accommodate the excess of the resin flowing out of the gaps between the metal electrodes within the closed frame of said elongated metal projection and to allow the resin to cure.

A process for producing a liquid crystal device in which a liquid crystal is disposed between a pair of oppositely disposed plates including at least one electrode plate comprising:

• a substrate, a plurality of metal electrodes formed with gaps therebetween on the substrate, a resin filling the gaps, and a plurality of transparent electrodes each electrically connected with an associated metal electrode;
• said process comprising the steps of:
• forming on said substrate said plurality of metal electrodes with gaps therebetween in a prescribed pattern,
• forming an elongated metal projection in a continuous and closed frame along all peripheral sides of a rectangular mold substrate, said elongated metal projection having a thickness substantially identical to that of the metal electrodes but having a width larger than that of the metal electrodes,
• placing a resin between the substrate and the mold substrate;
• pressing the mold substrate provided with said elongated metal projection toward the substrate under a pressure sufficient to deform the resin but not deform said elongated metal projection, thereby filling the gaps with the resin while allowing an excess of the resin to flow out of the gaps between the metal electrodes, and
• curing the resin at the gaps between the metal electrodes,
• wherein said elongated metal projection is spaced from the metal electrodes so that a spacing between said elongated metal projection and an outermost metal electrode closest and parallel thereto is wider than a gap between adjacent metal electrodes thereby to fully accommodate the excess of the resin flowing out of the gaps between the metal electrodes within the closed frame of said elongated metal projection and to allow the resin to cure.

A process for producing a liquid crystal device in which a liquid crystal is disposed between a pair of oppositely disposed plates including at least one electrode plate comprising:

• a rectangular substrate, a plurality of metal electrodes formed with gaps therebetween on the substrate, a resin filling the gaps, and a plurality of transparent electrodes each electrically connected with an associated metal electrode;
• said process comprising the steps of:
• forming on a substrate a plurality of metal electrodes with gaps therebetween in a prescribed pattern,
• forming an elongated metal projection in a continuous and closed frame shape along all peripheral sides of the substrate,
• said elongated metal projection having a thickness substantially identical to that of the metal electrodes but having a width larger than that of the metal electrodes,
• placing a resin between the substrate and a mold substrate,
• pressing the mold substrate toward the substrate provided with said elongated metal projection under a pressure sufficient to deform the resin but not deform the elongated metal projection, thereby filling the gaps with the resin while allowing an excess of the resin to flow out of the gaps between the metal electrodes, and
• curing the resin at the gaps between the metal electrodes,
• wherein said elongated metal projection is spaced from the metal electrodes so that a spacing between said elongated metal projection and an outermost metal electrode closest and parallel thereto is wider than a gap between adjacent metal electrodes thereby to fully accommodate the excess of the resin flowing out of the gaps between the metal electrodes within the closed frame of said elongated metal projection and to allow the excess resin to cure.