Led array, and led printer head

An LED array comprising:

• a first conductive-type semiconductor substrate;
• a second conductive-type semiconductor layer formed at a surface of said semiconductor substrate;
• a first conduction-side contact electrode formed on the surface of said semiconductor substrate where said semiconductor layer is formed, and connected to said semiconductor substrate;
• and
• a first conduction-side electrode, constituted of a first conduction-side pad electrode which is connected to said first conduction-side contact electrode, and that has a single-layer structure with the pad electrode achieved by forming said first conduction-side contact electrode and said first conduction-side pad electrode from a single conductive film.

An LED array comprising:

• a first conductive-type semiconductor substrate;
• a second conductive-type semiconductor layer formed at a surface of said semiconductor substrate;
• a first conduction-side pad electrode formed and bonded on a surface of said semiconductor substrate for connection with an external circuit;
• and
• a first conduction-side electrode formed on said surface of said semiconductor substrate where said semiconductor layer is formed, and connected with said first conductive-type semiconductor substrate.

An LED array comprising:

• a first conductive-type semiconductor substrate;
• N (N is an integer equal to or greater than 2) light emitting portions constituted of second conductive-type semiconductor layers formed in a single row at a surface of said first conductive-type semiconductor substrate;
• a first conduction-side electrode, to constitute a pad electrode for connecting said semiconductor substrate with an external circuit, formed on said surface of said semiconductor substrate;
• N second conduction-side electrodes individually connected with said light emitting portions, formed on said surface of said semiconductor substrate;
• and
• at least one second conduction-side pad electrode for connecting one of said N second conduction-side electrodes with an external circuit, wherein:
• said first conduction-side electrode is formed, relative to said row of light emitting portions, on a side of said light emitting portions where said second conduction-side pad electrode is present and is connected with said semiconductor substrate on said side where said second conduction-side pad electrode is present.

An LED printer head comprising:

• (a) an LED array provided with
• (a-1) a first conductive-type semiconductor substrate;
• (a-2) N (N is an integer equal to or greater than 2) light emitting portions constituted of second conductive-type semiconductor layers formed in a single row at a surface of said semiconductor substrate;
• (a-3) a first conduction-side electrode, to constitute a pad electrode connecting said semiconductor substrate with an external circuit, formed on said surface of said semiconductor substrate;
• (a-4) N second conduction-side electrodes, individually connected with said light emitting portions, formed on said surface of said semiconductor substrate;
• and
• (a-5) at least one second conduction-side pad electrode for connecting one of said N second conduction-side electrodes with an external circuit, with:
• (a-6) said first conduction-side electrode formed on a where said second conduction-side pad electrode is present, relative to said row of said light emitting portions, and said first conduction-side electrode connected with said semiconductor substrate on said side where said second conduction-side pad electrode is present;
• (b) a drive circuit for driving said LED array;
• (c) a first wire bonded to said first conduction-side electrode and drawn out from one side of said LED array to be bonded with said drive circuit;
• and
• (d) a second wire bonded to said second conduction-side pad electrode and drawn out from one side of said LED array to be bonded with said drive circuit.