Antenna-integrated microwave-millimeter wave module
AssigneeSharp Kabushiki Kaisha
InventorsNaoki Sakota, Atsushi Yamada, Koki Kitaoka
Life of this patent
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Abstract
A microwave circuit or a millimeter wave circuit is formed on a semiconductor chip. A multilayer substrate is formed of a first dielectric layer, a second dielectric layer and a third dielectric layer. A high-frequency circuit line with the semiconductor chip mounted thereon is formed on the third dielectric layer. A slot hole is formed on one side of the second dielectric layer and an antenna feeding line is formed on the other side. The first dielectric layer has a plurality of slot holes formed therein that radiate electromagnetic waves. An organic substrate is laminated to the multilayer substrate by an adhesion layer.
Claims11
An antenna-integrated microwave-millimeter wave module comprising:
- a dielectric substrate;
- a first conductor layer provided on said dielectric substrate and having a plurality of first holes formed therein to radiate electromagnetic waves;
- a first dielectric layer provided on said first conductor layer;
- an antenna feeding line provided on said first dielectric layer;
- a second dielectric layer provided on said antenna feeding line;
- a second conductor layer provided on said second dielectric layer and having a second hole formed therein;
- a third dielectric layer provided on said second conductor layer;
- a high-frequency circuit line provided on said third dielectric layer;
- and
- a semiconductor chip connected to said high-frequency circuit line and having a microwave or millimeter wave circuit formed,
- said first, second and third dielectric layers each having a thickness of λ/4 or less, λ representing wavelength of electromagnetic waves propagating through the dielectric layers, and
- said first, second and third dielectric layers having a relative dielectric constant of 10 or less.
An antenna-integrated microwave-millimeter wave module comprising:
- a first conductor layer having a plurality of first holes formed therein to radiate electromagnetic waves;
- a first dielectric layer provided on said first conductor layer;
- an antenna feeding line provided on said first dielectric layer;
- a second dielectric layer provided on said antenna feeding line;
- a second conductor layer provided on said second dielectric layer and having a second hole formed therein;
- a third dielectric layer provided on said second conductor layer;
- a high-frequency circuit line provided on said third dielectric layer and electromagnetically coupled with said antenna feeding line via said second hole;
- and
- a semiconductor chip connected to said high-frequency circuit line and having a microwave or millimeter wave circuit formed,
- said first holes including a feed slot hole fed by said antenna feeding line and a non-feed slot hole not fed by said antenna feeding line, and
- distance d between said feed slot hole and said non-feed slot hole being approximately (0.5+n) λ, λ representing wavelength of electromagnetic waves propagating through the dielectric layers and n being an integer of at least 1.
Dependencies are inferred from the claim text.