Semiconductor inspection apparatus and inspection method using the apparatus
AssigneeFujitsu Limited
InventorsNorio Fukasawa, Yukinori Sumi
Life of this patent
Estimating the term…
Abstract
A semiconductor inspection apparatus performs a test on a to-be-inspected device which has a spherical connection terminal. This apparatus includes a conductor layer formed on a supporting film. The conductor layer has a connection portion. The spherical connection terminal is connected to the connection portion. At least a shape of the connection portion is changeable. The apparatus further includes a shock absorbing member, made of an elastically deformable and insulating material, for at least supporting the connection portion.
Claims2
A semiconductor inspection apparatus for performing a test on a to-be-inspected device which has a spherical connection terminal, said apparatus comprising:
- a conductor layer formed on a supporting film, said conductor layer having a connection portion, said spherical connection terminal is connected to said connection portion, at least a shape of said connection portion being changeable;
- and
- a shock absorbing member, made of an elastically deformable and insulating material for at least supporting said connection portion, wherein said connection portion has a single-layer or multilayer stacked stud bump projecting toward said spherical connection terminal which is loaded on said apparatus, and said stub bump comprises a nail-head portion projecting into said spherical connection terminal.
Dependencies are inferred from the claim text.