Automated monitoring of placement of an IC package onto a socket for proper orientation and proper alignment

A socket cover for monitoring that an IC (integrated circuit) package is properly placed onto a socket, the socket cover comprising:

• a platform that is attached on top of said socket, said platform having an opening for exposing pins of said socket when said platform is attached onto said top of said socket;
• wherein said IC package is placed within said opening of said platform and onto said pins of said socket for testing of said IC package;
• a signal generator disposed on a first side of said opening of said platform for emitting a signal across said opening toward a second side of said opening;
• a signal detector disposed on said second side of said opening of said platform, wherein said signal detector is aligned with said signal generator such that said signal detector detects said signal emitted by said signal generator when said signal is not blocked;
• and wherein said signal generator is a LED (light emitting diode) for emitting light as said signal toward said signal detector that is a photo diode for detecting said light;
• and wherein said signal detector detects said signal emitted by said signal generator when said IC package that is placed with proper orientation and proper alignment within said opening of said platform does not block said signal;
• and wherein said signal detector does not detect said signal emitted by said signal generator when said IC package that is placed with improper orientation or improper alignment within said opening of said platform does block said signal;
• and wherein said signal detector is coupled to a warning unit for generating an alarm signal when said signal detector does not detect said signal emitted by said signal generator when said IC package that is placed with improper orientation or improper alignment within said opening of said platform does block said signal;
• and wherein a cylinder head extends down to press down said IC package onto said pins of said socket after placement of said IC package onto said pins of said socket;
• a cylinder controller for controlling said cylinder head to not extend down toward said IC package when said signal detector does not detect said signal emitted by said signal generator indicating that said IC package that is placed with improper orientation or improper alignment within said opening of said platform is blocking said signal;
• and wherein said cylinder controller controls said cylinder head to extend down toward said IC package when said signal detector detects said signal emitted by said signal generator indicating that said IC package that is placed with proper orientation and proper alignment within said opening of said platform is not blocking said signal;
• and wherein said cylinder controller controls said cylinder head to retract away from said IC package when said cylinder head is extended to press down on said IC package toward said pins of said socket and after completion of testing of said IC package within said socket, and wherein removal of said IC package after said completion of testing of said IC package causes resetting of said cylinder controller when said IC package blocks said signal from reaching said signal detector during said removal of said IC package from said socket;
• and wherein said cylinder controller controls said cylinder head that is retracted to not extend down after completion of testing of said IC package if said cylinder controller is not reset, to prevent repeated testing of said IC package;
• a chamfered corner of the opening of said platform, wherein said chamfered corner of the opening of said platform aligns with a chamfered corner of said IC package when said IC package is placed within said opening of said platform with proper orientation;
• and
• guide posts disposed on said platform for guiding placement of said cylinder head onto said IC package when said cylinder head extends down.

A method for monitoring that an IC (integrated circuit) package is properly placed onto a socket, the method including the steps of:

• attaching a platform of a socket cover on top of said socket, said platform having an opening for exposing pins of said socket when said platform is attached onto said top of said socket;
• placing said IC package within said opening of said platform and onto said pins of said socket for testing of said IC package;
• emitting from a signal generator, disposed on a first side of said opening, a signal across said opening toward a second side of said opening;
• detecting, at a signal detector disposed on said second side of said opening of said platform, said signal emitted by said signal generator when said signal is not blocked;
• detecting at said signal detector said signal emitted by said signal generator when said IC package that is placed with proper orientation and proper alignment within said opening of said platform does not block said signal;
• and
• not detecting at said signal detector said signal emitted by said signal generator when said IC package that is placed with improper orientation or improper alignment within said opening of said platform does block said signal.