Probe card and manufactoring method therefor

The method of manufacturing a probe card for use in testing characteristics of electric components, the method comprising:

• preparing a first substrate having a top surface and a bottom surface, said top surface projecting upwards to form a protrusion integral with said first substrate;
• forming a plurality of through holes penetrating said first substrate from said bottom surface to said top surface through said protrusion;
• forming first transmission lines at least in said through holes;
• superposing a second substrate on the first substrate;
• forming second transmission lines on a top surface of the second substrate connected to said first transmission line;
• cutting the first and second substrates in a predetermined shape;
• and
• forming a probe needles on the second substrate.

The method of manufacturing a probe card for use in testing characteristics of electric components, the method comprising:

• forming a first transmission line in a first substrate which includes a flat portion, a substantially central protrusion provided on a top surface of a substantially center of the flat portion and a peripheral protrusion which is disposed away from the substantially central protrusion with a predetermined distance and which is provided on the top surface of a peripheral-side of the flat portion;
• superposing a second substrate on the first substrate;
• forming a second transmission line in the second substrate;
• cutting the second substrate along a periphery of said central protrusion;
• cutting the first substrate along an inner periphery of said peripheral protrusion;
• and
• forming a probe needle on the second substrate.