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US 6,388,325 B2Granted
Multi-layer interconnect
AssigneeAlliedSignal Inc.
InventorsRichard Pommer, Simon McElrea, Brad Banister
Life of this patent
Estimating the term…
Abstract
Methods and apparatus for increasing the yield achieved during high density interconnect (HDI) production. In particular, processes in which panels are tested to identify good cells/parts, good cells are removed from the panels, and new panels created entirely of identified/known good cells allow increases in the number of layers used in a HDI without incurring the decrease in yield normally associated with such a layering process.
Claims14
A multi-celled assembly comprising:
- a plurality of horizontally adjacent cells wherein each cell comprises at least one base material layer and at least one conductive pattern;
- the adjacent cells of the assembly being bound together solely by an adhesive material.
A multi-celled assembly comprising a plurality of horizontally adjacent cells wherein:
- each cell is a stack of alternating bond-ply and known good layer-pair layers;
- the known good layer-pair layers each comprise at least one base material layer and at least one conductive pattern;
- the bond-ply layers each comprise an adhesive material wherein the composition of the adhesive material differs from the composition of the base material layers,
- each bond-ply layer is sandwiched between two known good layer-pair layers;
- and
- the adjacent cells of the assembly are bound together solely by the adhesive material of the bond-ply layers.
3 more elements
Dependencies are inferred from the claim text.